| Part Number | Manufacturer | Technology | Capacity | Interface | Voltage | Temperature | Package | Product Status |
|---|---|---|---|---|---|---|---|---|
| H26M51002KPR | SK Hynix | eMMC 5.1 | 16GB | - | - | - | 11.5x13x0.8mm | Mass Production |
| H26M62002JPR | SK Hynix | eMMC 5.1 | 32GB | - | - | - | 11.5x13x0.8mm | Mass Production |
| H26M74002HMR | SK Hynix | eMMC 5.1 | 64GB | - | - | - | 11.5x13x1.0mm | Mass Production |
| H26M41208HPR | SK Hynix | eMMC 5.1 | 8GB | - | - | - | 11.5x13x0.8mm | Mass Production |
| KLMCG8GESD-B03Q | Samsung | eMMC 5.0 | 64 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 1.0 mm | EOL |
| KLMCG8GESD-B03P | Samsung | eMMC 5.0 | 64 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
| KLMBG4GESD-B03Q | Samsung | eMMC 5.0 | 32 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 1.0 mm | EOL |
| KLMBG4GESD-B03P | Samsung | eMMC 5.0 | 32 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
| KLMAG2GESD-B03Q | Samsung | eMMC 5.0 | 16 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLMAG2GESD-B03P | Samsung | eMMC 5.0 | 16 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLM8G1GESD-B03Q | Samsung | eMMC 5.0 | 8 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLM8G1GESD-B03P | Samsung | eMMC 5.0 | 8 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 0.8 mm | EOL |
