| Part Number | Manufacturer | Technology | Capacity | Interface | Voltage | Temperature | Package | Product Status |
|---|---|---|---|---|---|---|---|---|
| KLMAG1JETD-B041 | Samsung | eMMC 5.1 | 16 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 0.8 mm | Mass Production |
| KLM8G1GETF-B041 | Samsung | eMMC 5.1 | 8 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 0.8 mm | Mass Production |
| KLM8G1GESD-B04Q | Samsung | eMMC 5.1 | 8 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLM8G1GESD-B04P | Samsung | eMMC 5.1 | 8 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLMEG8UCTA-B041 | Samsung | eMMC 5.1 | 256 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
| KLMDG4UCTA-B041 | Samsung | eMMC 5.1 | 128 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 1.0 mm | EOL |
| KLMCG2UCTA-B041 | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLMCG2KCTA-B041 | Samsung | eMMC 5.1 | 64 GB | HS400 | 1.8 / 3.3 V | -25 ~ 85 °C | 11.5 x 13 x 0.8 mm | EOL |
| KLMBG4GEUF-B04Q | Samsung | eMMC 5.1 | 32 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 0.8 mm | Mass Production |
| KLMBG4GEUF-B04P | Samsung | eMMC 5.1 | 32 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 0.8 mm | Mass Production |
| KLMAG2GEUF-B04Q | Samsung | eMMC 5.1 | 16 GB | HS400 | 1.8 / 3.3 V | -40 ~ 105 °C | 11.5 x 13 x 0.8 mm | Mass Production |
| KLMAG2GEUF-B04P | Samsung | eMMC 5.1 | 16 GB | HS400 | 1.8 / 3.3 V | -40 ~ 85 °C | 11.5 x 13 x 0.8 mm | Mass Production |
